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IS
Integrated Silicon Solution Inc.
XX
Product Family
21 = Managed NAND22 = Automotive Managed NAND
X
Technology
E = ISSI eMMC
X
Interface
S = eMMC 5.0F = eMMC 5.1
XXX
Density
04G = 4GB08G = 8GB16G = 16GB32G = 32GB
X
Die Revision
Blank = First generation
X
Option
J = Standard
X
Package Type
C = 153-ball FBGAQ = 100-ball FBGA
X
Pacakge Content
L = RoHS compliant
X
Temperature Range
I = Industrial (-40°C to 85°C)A1 = Automotive Grade (-40°C to 85°C)
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.